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DAEJOO provides conductive pastes designed for End termination electrode of chip-resistor and chip-inductor. They show good application efficiency, low volume resistivity, and high reliability.
 
Specification
Product DS-7260THM(DG) DS-7260THM(T) DS-7260THM(N) DS-7275HD DS-7260EB(N) DS-7260EB(H) Test method
Color Dark gray Silver white    
Viscosity
@25℃
25±1 kcps 30±1 kcps 25±1 kcps 28±4kcps 21±1 kcps 19±2 kcps Brookfield DV-II,
SC4-14
@25±0.5℃,10rpm
Thixotropic
index
4.0 ± 0.5 3.8 ± 0.5 3.0 ± 0.5 3.0 ± 0.5 10rpm / 100rpm
Pencil
hardness
above 3H Using wood pencil
(3H, 4H, 5H)
Adhesion 100/100 1mm×1mm×100
(Alumina plate)
Volume
resistivity
< 2.0 ×10-4Ω㎝ < 1.0 ×10-4Ω㎝ < 2.0 ×10-4Ω㎝ Zig-Zag Pattern
Ni plating
adhesion
above 2.0 kgf Push-Pull Gauge
Pot life 10 day @40℃ -
Dry & Cure Condition Dry condition : Above 150℃-5min, Cure condition: Above 200℃-30min -
Feature Roller type (Array) Low volume Resistivity
(0 ohm)
Dipping type -
DAEJOO provides conductive adhesives for curing type, applicable to bonding between lead frame and metal chip.
They are well designed for low crystal impedance and high frequency stability according to temperature.
Also, they have good rheological properties well applicable to dispensing system.
 
Specification
Product DS-0916 AT Test Method
Application Dispensing, Pin transfer -
Metal contents 80 ± 2% TGA
Viscosity 22 ± 2 kcps Brookfield HB-DV-II # 14 @25℃(50rpm)
Thixotropy Index
6.5 ± 1 0.5rpm/5rpm
Volume Resistivity ≤ 2.0×10-4 Ωcm Zig-Zag Pattern
Die Shear
Strength
R/T ≥ 15.0 kg Si Chip / lead frame
(Size 2×2mm)
250℃ ≥ 3.0 kg Curing: 170℃×7min convection oven
Shelf life 1 year (-40℃) -