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Sealing glass for low temperature type, laser sealing glass(FPD, OLED, DSSC)
- It is used as OLED Sealing by protecting the organic device from dust and moisture, as well as excellent adhesion.
- It is able to be sintered even in low temperature, so applicable to display sealing materials as well as OLED Seal.
 
OLED (organic light-emitting diode) structure
DSSC (Dye-sensitized solar cell) structure
  Thermal property (℃)        
Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
Bi2O3-ZnO-B2O3 350-400 400-450 70-90 1.5-2.5 Yellow OLED, DSSC, etc
B2O3-ZnO-BaO 450-500 480-550 70-90 1.5-2.5 White DSSC, etc
V2O5-TeO2-BaO 450-500 350-400 60-90 1.5-2.5 Black OLED, etc
Glass materials for solar cell electrode pastes
- It is used for solar cell electrode pastes, showing excellent electrical properties and efficiencies.
- It prevents occurs of bending by good matching with any wafer.
 
  Thermal property (℃)        
Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
PbO-SiO2-Al2O3 350-400 400-450 70-90 1.5-2.5 White Front-Ag paste, Back-Ag paste, Back-Al paste
PbO-SiO2-ZnO 350-400 400-450 70-100 1.5-2.5 White Front-Ag paste, Back-Ag paste, Back-Al paste
Bi2O3-ZnO-B2O3 350-400 400-450 70-90 1.5-2.5 Brown Front-Ag paste, Back-Ag paste, Back-Al paste
Bi2O3-SiO2-CuO 480-530 520-560 70-90 1.5-2.5 Brown Front-Ag paste, Back-Ag paste, Back-Al paste
SiO2-V2O5-B2O3 380-430 400-450 70-90 1.5-2.5 Brown Front-Ag paste, Back-Ag paste, Back-Al paste
B2O3-ZnO-BaO 450-500 480-550 70-90 1.5-2.5 White Front-Ag paste, Back-Ag paste, Back-Al paste
Electronic components (LTCC, MLCC, Overglazed, etc)
- DAEJOO'S glass powders and glass pastes are used for chip components.
- They are used as body of chip components like LTCC, MLCC. Also used as overglaze in chip resistor.
- They are showing the excellent properties of dielectric, resistance, chemically-resistant.
- DAEJOO is retaining a variety types of glass materials.
Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
BaO-ZnO-B2O3 450-500 500-550 70-100 2.0-3.0 White Resistance, Electrode
SIo2-BaO-B2O3 630-690 680-730 70-100 2.0-3.0 White Overglazing
Bi2O3-ZnO-B2O3 350-400 400-450 70-90 1.5-2.5 Yellow Resistance, Electrode
Bi2O3-SiO2-CuO 480-530 520-560 70-90 1.5-2.5 Yellow Resistance, Electrode
SiO2-B2O3-Li2O 500-550 55-600 70-90 1.0 -1.5 White Resistance, Electrode
Glass materials for LED applilcations(Encapsulation)
- It is glass frit for LED applications, processed in low temperature.
- It shows high transparency, high density, and high reflexibility.
 
 
  Thermal property (℃)        
Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
SiO2-B2O3-ZnO 500-550 550-600 70-90 5.0-20.0 White LED (for Encapsulation)
SiO2-B2O3-ZnO-BaO 450-500 500-550 70-100 5.0-20.0 White LED (for Encapsulation)
* Tg - glass Transition temperature
* Glass Transition temperature - Dilatometric softening point
* CTE - Coefficient of Thermal Expansion
* CTE - Temp range - 50-350℃